Silver Epoxy Adhesive

Resists vibration impact thermal cycling.

Silver epoxy adhesive. It is smooth non sagging thixotropic and bonds well to a wide variety of substrates. Excellent peel and shear strength. It cures at low temperatures to avoid damage to electronic equipment and bonds well to most materials. The mg chemicals 8331 is a two part silver filled epoxy adhesive with good conductivity and a faster working time than mg chemicals 8331s adhesive to bond electronic devices form conductivity seals and cold solder heat sensitive materials.

Low linear shrinkage upon cure. Silver filled electrically conductive epoxy adhesive. It is smooth non sagging thixotropic and bonds well to a wide variety of substrates. 8331 is an electrically conductive silver filled 2 part epoxy adhesive.

It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive connections. It has a convenient 1 to 1 ratio ten minutes work life and a moderate curing rate. Serviceable from 4k to 250 f. It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive.

It can be used as a solder replacement for bonding heat sensiti. 8331 is an electrically conductive silver filled two part epoxy adhesive. Moderate cure high conductivity are an economical electronic epoxy with good electrical and thermal conductivities. One component heat curing silver conductive epoxy adhesive.

Cures at room temperature. This product allows for quick cold soldering repairs. This product allows for quick cold soldering repairs. The 8331 silver conductive epoxy adhesive.